Tgon 810; A1 /A10463-12

Laird: Tgon 810, A1 18x24in, t=0,25mm 5W/mK A10463-12, 457x609x0,25mm, A1= with suffix, Electrically and Thermally
Conductive Interface Pad
TgonTM800 Series
Electrically and Thermally Conductive Interface Pad

High-PERFORMANCE, cost effective thermal interface mater ial

Used where electrical isolation is not required, Tgon™ 800 is ideal for where electrical contact and thermal transfer are desired.
Its unique grain-oriented, plate-like structure provides a high thermal conductivity of 240 W/mK in the XY plane and 5 W/mK through the z-axis.. Tgon 800 can be supplied in 12” x 18” (305mm x 457mm) or 18” x 24” (457mm x 610mm) sheets, rolls or die-cut to specific configurations.
It is also available with proprietary pressure sensitive adhesive on one side. This adhesive coating is the thinnest available, minimizing any impact on thermal performance.

FEATURES
• High thermal conductivity of 5 W/mK in Z axis and 240 W/mK in the X-Y axis
• >98% graphite
• Low thermal resistance
• Thicknesses of 0.005”, 0.010” and 0.020” (0.125mm, 0.25mm, and 0.50mm)

APPLICATIONS
• Power conversion equipment
• Power supplies
• Large telecommunications switching hardware
• Notebook computers
• Where electrical grounding is required with good thermal conductivity