Laird: T-flex 3100 9"x9" Thermal Pad, t=2,54mm Laird Pad

Verkaufspreis ohne MwSt. / ks

21,5220 EUR

Beschreibung

Tflex 300, at pressures of 50psi, will deflect to over 50% the original thickness. This high
rate of compliancy allows the material to totally blanket the component, enhancing
thermal transfer. The material has a very low compression set enabling the pad to be reused
many times.
Tflex 300, in achieving its stellar compliancy, does not sacrifice thermal performance.
With a thermal conductivity of 1.2 W/mK, low thermal resistances can be achieved at low
pressures.
Tflex 300-H is offered with a hard, metallized liner option for easy handling and improved
rework. The metallized liners lower coefficient of friction also allows for easy assembly of
parts that must slide together, such as a card into a chassis.

Lagername	Verfügbarkeit	Davon reserviert	Verkaufspreis ohne MwSt.
ATD hlavní sklad	19	0	21,5220 EUR