Tflex HD7120, PI 9"x9" t=0,16"

Tflex HD7120, PI 9"x9" t=0,16" Laird TIM Gap Fillers, with PI liner,228,6x228,6x4mm
Tflex™ HD700 thermal gap filler combines 5 W/mK thermal conductivity with superior pressure versus deflection characteristics. The combination will allow minimal stress on components while also yielding low thermal resistance. As a result, less mechanical and thermal stresses will be experienced within your device. Tflex™ HD700PI can be provided with an integrated polyimide film on one side. This liner provides numerous application benefits like electrical isolation, placement ease during assembly, and tear resistance for applications that require shear. Tflex™ HD700 and Tflex™ HD700PI are available in thickness from 0.5mm (0.020”) to 5mm (0.200”). The standard material Tflex™ HD700 material is a light pink color, but we do have the option to provide this in a grey color if a neutral color is desired (Tflex HD700,GR). Laird can provide material to meet your production needs in any region through our local production facilities.
FEATURES AND BENEFITS
5.0 W/mK thermal conductivity
Low pressure versus deflection
Excellent surface wetting for low contact resistance
Minimizes board and component stress
Option for additional electrical isolation and tear resistance Environmentally friendly solution that meets regulatory requirements including RoHS and REACH
A18478-16