Tflex HD330TG 17.5"x18"x0.03"

Laird Tflex HD330TG 17.5"x18"x0.03" Thermal Pad Pink Tgard liner on top; 457.20mm x 444.50mm t=0,762oducts. Tflex HD300 is an excellent choice when wide manufacturing tolerances occur as variable gaps can be filled with Tflex HD300 while generating minimal board and component stress. Lairdˇ¦s unique manufacturing capabilities, and filler and resin knowledge result in this unique product designed with customer applications in mind.
Tflex HD300 material exhibits excellent surface wetting characteristics and high deflection properties ensuring low contact resistances and providing an overall lower total thermal resistance.
A Tgard™ liner at one side option is provided to form into Tflex HD300TG, offer guaranteed >6KV AC dielectric barrier, is cut-through resistant and enables easy non-tacky handling at one side. A Tgard™ liner in the middle option is provided to form into Tflex HD300MTG for 40mil and above thicknesses, offer guaranteed >6KV AC dielectric barrier, has cut-through resistant and two-sided tackiness.
TflexTM HD300 is provided in thickness from 0.5mm (0.020") up to 5mm (0.200") in 0.5mm (0.020") increments as standard. In addition, Laird can provide TflexTM HD300 in multiple converted formats through approved converters and distribution networks.
FEATURES AND BENEFITS
2.7 W/m K thermal conductivity
Low pressure versus deflection characteristics
Excellent surface wetting for low contact resistance
Minimizes board and component stress.
Large tolerance applications
RoHS and REACH compliant

A17876-03