Tflex SF860 9"x9"x0,06"

Laird Tflex SF860 9"x9"x0,06" Thermal Pad Gray 228x228x1,5mm Square
Tflex™ SF800 is a high-performance, compliant, silicone free thermal interface material.
By coupling extremely high thermal conductivity with exceptional etting characteristics, Tflex™ SF800 provides some of the lowest thermal resistance values in the industry. This makes it wellsuited for applications where silicone based pads are traditionally used as well as those applications which are silicone sensitive.
Tflex™ SF800 is naturally tacky on both sides requiring no additional adhesive coating, which would inhibit thermal performance. The natural tack allows for the pad to be held in place during assembly.
FEATURES AND BENEFITS
• Silicone-free gap filler
• Thermal Conductivity of 7.8W/mK
• Exceptionally low thermal resistance
• Environmentally friendly solution that meets regulatory requirements including RoHS and REACH
A15754-06