Tflex HR640 229*229*1,0mm

Laird Tflex HR640 229x229x1,0 mm 3W/mK: Tflex™ HR600 is a cost-effective and compliant gap filler thermal interface material with excellent thermal performance and great handling for mass-production applications. The low modulus interface pad conforms to component topography, resulting in little stress on the components, mating chassis or parts. The softness relieves mechanical stress from high stack-up tolerance and absorbs shock, resulting in improved device reliability. Tflex HR600’s recovery properties for applications requiring material rework result in continued mechanical integrity even after device rework and re-assembly.

Tflex HR600 is naturally tacky on both sides and requires no additional adhesive coating to inhibit thermal performance. The tack is designed to hold the pad in place
during assembly and component transport.

Tflex HR600 is electrically insulating, stable from -45 °C bis 200 °C, and meets UL 94V0 flame rating.

Features and Benefits
• Thermal conductivity 3 W/mK
• Soft and compliant
• Available in thicknesses from 0.010” thru 0.200” (0.25mm thru 5.0mm)
• Naturally tacky for adhesion during assembly and transport