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Tflex 750 9"x9", 5 W/mK, Thermal Gap Filler
Laird Tflex 750 9"x9", 5 W/mK Thermal Gap Filler,228,60mmx228,60mmx1,27mm
Price (net of VAT) / ks
88,6520 EUR
Tflex 750 9"x9" 5W/mK : Tflex™ 700 is a 5 W/mK soft gap filler thermal interface material with great thermal performance and high compliancy. The soft interface pad conforms to component topography, resulting in little or no stress on the components and mating chassis or parts.
Unique silicone and ceramic filler technology allows a combination of high compliancy and high thermal performance. Tflex™ 700 is stable from -40°C thru 200°C and meets UL 94V0 flame rating. Naturally tacky, it requires no additional adhesive coating which inhibits thermal performance.
FEATURES AND BENEFITS
- Thermal conductivity 5.0 W/mK
- Highly compliant
- Low thermal resistance even at low pressure
- Available in thicknesses from 0.5mm thru 5.0mm (0.020” thru 0.200”) in 0.25mm (0.010”) increments
- Naturally tacky for adhesion during assembly and transport
Unique silicone and ceramic filler technology allows a combination of high compliancy and high thermal performance. Tflex™ 700 is stable from -40°C thru 200°C and meets UL 94V0 flame rating. Naturally tacky, it requires no additional adhesive coating which inhibits thermal performance.
FEATURES AND BENEFITS
- Thermal conductivity 5.0 W/mK
- Highly compliant
- Low thermal resistance even at low pressure
- Available in thicknesses from 0.5mm thru 5.0mm (0.020” thru 0.200”) in 0.25mm (0.010”) increments
- Naturally tacky for adhesion during assembly and transport
| Store name | Availability | Of which reserved | Price (net of VAT) | |
|---|---|---|---|---|
| ATD hlavní sklad | 0 | 0 | 88,6520 EUR |
Tflex 750