Tflex UT20250, ultra-thin gap filler

Tflex™ UT20250 is a specially formulated ultra-thin gap filler thermal interface material designed T=0,25mm; W/mK - 3,0; 9x9"
for thin interfaces that offers excellent thermal performance and high compliancy. Tflex™ UT20000 provides excellent interfacing and its ability to wet out mating surfaces allows for efficient transfer of heat away from components. It is an ideal choice for low-pressure applications and optimum solution in handheld devices with thin interface gap and limited space requirements.
Tflex™ UT20000 is electrically non-conductive, stable from -50°C thru 200°C and offered in
thicknesses that range from 0.008” (200 µm) up to 0.040” (1000 µm).