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Tflex 340, 9x9in, 1 mm
Laird: Tflex 340, 9x9in, 1 mm 1,2W/mK Thermal Gap Filler, 9"x9", t=1,00mm .A15324-01
Price (net of VAT) / ks
13,9130 EUR
Laird: Tflex 340, 9x9in, 1 mm 1,2W/mK
UNIQUE SILICONE GEL OFFERS COMPLIANCY, THERMAL RESISTANCE
Tflex™ 300, at pressures of 50psi, will deflect to over 50% the original thickness. This high rate of compliancy allows the material to “totally blanket” the component, enhancing thermal transfer. The material has a very low compression set enabling the pad to be reused
many times.
Tflex™ 300, in achieving its stellar compliancy, does not sacrifice thermal performance. With a thermal conductivity of 1.2 W/mK, low thermal resistances can be achieved at low pressures.
Tflex™ 300-H is offered with a hard, metallized liner option for easy handling and improved rework. The metallized liner’s lower coefficient of friction also allows for easy assembly of parts that must slide together, such as a card into a chassis.
Tflex™ 300-TG is offered with a cut-through resistant Tgard™ silicone liner. The TG liner offers a guaranteed dielectric barrier, and easier part handling for mass production.
FEATURES AND BENEFITS
• Extreme compliancy allows material to “totally blanket” component(s)
• Thermal conductivity of 1.2 W/mK
• Available in thicknesses from 0.020” - 0.200” (.5mm – 5.0mm)
• Low compression set enables the pad to be reused many times
UNIQUE SILICONE GEL OFFERS COMPLIANCY, THERMAL RESISTANCE
Tflex™ 300, at pressures of 50psi, will deflect to over 50% the original thickness. This high rate of compliancy allows the material to “totally blanket” the component, enhancing thermal transfer. The material has a very low compression set enabling the pad to be reused
many times.
Tflex™ 300, in achieving its stellar compliancy, does not sacrifice thermal performance. With a thermal conductivity of 1.2 W/mK, low thermal resistances can be achieved at low pressures.
Tflex™ 300-H is offered with a hard, metallized liner option for easy handling and improved rework. The metallized liner’s lower coefficient of friction also allows for easy assembly of parts that must slide together, such as a card into a chassis.
Tflex™ 300-TG is offered with a cut-through resistant Tgard™ silicone liner. The TG liner offers a guaranteed dielectric barrier, and easier part handling for mass production.
FEATURES AND BENEFITS
• Extreme compliancy allows material to “totally blanket” component(s)
• Thermal conductivity of 1.2 W/mK
• Available in thicknesses from 0.020” - 0.200” (.5mm – 5.0mm)
• Low compression set enables the pad to be reused many times
| Store name | Availability | Of which reserved | Price (net of VAT) | |
|---|---|---|---|---|
| ATD hlavní sklad | 107 | 0 | 13,9130 EUR |
Laird THR-DS-Tflex 300TG 0611 The high rate of compliancy of Tflex 300TG allows the material to “totally blanket”
the component, enhancing thermal transfer. The material has a very low compression
set enabling the pad to be reused many times. Tflex 300TG, in achieving its stellar
compliancy, does not sacrifice thermal performance. With a thermal conductivity of
1.2 W/mK, low thermal resistance can be achieved at low pressures.