Tflex 3160 228x228x4 mm ; A15336-01

Tflex 3160 228x228x4 mm Thermal Gap Filler, A15336-01
Product Description
Tflex™ 300, at pressures of 50psi, will deflect to over 50% the original thickness. This high rate of compliancy allows the material to “totally blanket” the component, enhancing thermal transfer.
The material has a very low compression set enabling the pad to be reused many times.
Tflex™ 300, in achieving its stellar compliancy, does not sacrifice thermal performance. With a thermal conductivity of 1.2 W/mK, low thermal resistances can be achieved at low pressures.
Tflex™ 300H is offered with a hard, metallized liner option for easy handling and improved rework. The metallized liner’s lower coefficient of friction also allows for easy assembly of parts that must slide together, such as a card into a chassis.
Tflex™ 300TG is offered with a cut-through resistant Tgard™ silicone liner. The TG liner offers a guaranteed dielectric barrier, and easier part handling for mass production.

FEATURES AND BENEFITS
• Extreme compliancy allows material to “totally blanket” components
• Thermal conductivity of 1.2 W/mK
• Low compression set enables the pad to be reused many times
• Environmentally friendly solution that meets regulatory requirements including RoHS and
REACH